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1. product profile 1.1 general description the BGA7024 mmic is a one-stage amplifier, available in a low-cost surface-mount package. it delivers 24 dbm output power at 1 db gain compression and superior performance up to 2700 mhz. 1.2 features and benefits ? 400 mhz to 2700 mhz frequency operating range ? 16 db small signal gain at 2 ghz ? 24 dbm output power at 1 db gain compression ? integrated active biasing ? external matching allows broad application optimization of the el ectrical performance ? 5 v single supply operation ? all pins esd protected 1.3 applications 1.4 quick reference data [1] operation outside this range is possible but not guaranteed. [2] p l = 11 dbm per tone; spacing = 1 mhz. BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier rev. 01 ? 28 may 2010 product data sheet ? broadband cpe/moca ? industrial applications ? wlan/ism/rfid ? e-metering ? wireless infrastructure (base station, repeater, point-to-point backhaul systems) ? satellite master antenna tv (smatv) table 1. quick reference data input and output impedances matched to 50 . typical values at v cc =5v; t case =25 c; unless otherwise specified. symbol parameter conditions min typ max unit i cc supply current 95 110 125 ma f frequency [1] 400 - 2700 mhz g p power gain f = 2140 mhz 13.5 15 16.5 db p l(1db) output power at 1 db gain compression f = 2140 mhz 24.0 25.5 - dbm ip3 o output third-order intercept point f = 2140 mhz [2] 35.0 38.5 - dbm
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 2 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier 2. pinning information [1] this pin is dc-coupled and requires an external dc-blocking capacitor. [2] the center metal base of the sot89 also f unctions as heatsink for the power amplifier. 3. ordering information 4. functional diagram table 2. pinning pin description simplified outline graphic symbol 1v cc(rf) [1] 2gnd [2] 3rf_in [1] 321 sym13 0 2 1 3 table 3. ordering information type number package name description version BGA7024 - plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads sot89 fig 1. functional diagram bandgap bias enable v/i converter v cc(rf) gnd 1 2 3 rf_in 014aab020
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 3 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier 5. limiting values 6. thermal characteristics 7. static characteristics 8. dynamic characteristics table 4. limiting values in accordance with the absolute ma ximum rating system (iec 60134). symbol parameter conditions min max unit v cc(rf) rf supply voltage - 5.7 v p i(rf) rf input power - 25 dbm t case case temperature ? 40 +85 c t j junction temperature - 150 c v esd electrostatic discharge voltage human body model (hbm); according to jedec standard 22-a114e -2000v charged device model (cdm); according to jedec standard 22-c101b -500v table 5. thermal characteristics symbol parameter conditions typ unit r th(j-c) thermal resistance from junction to case t case =85 c; v cc =5v; i cc =110ma 38 k/w table 6. characteristics input and output impedances matched to 50 . typical values at v cc =5v; t case =25 c; unless otherwise specified. symbol parameter conditions min typ max unit v cc supply voltage - 5.0 - v i cc supply current 95 110 125 ma table 7. dynamic characteristics input and output impedances matched to 50 . typical values at v cc =5v; t case =25 c; see section 12 ? application information ? ; unless otherwise specified. symbol parameter conditions min typ max unit f frequency [1] 400 - 2700 mhz g p power gain f = 940 mhz - 22 - db f = 1960 mhz - 16 - db f = 2140 mhz 13.5 15 16.5 db f = 2445 mhz - 14 - db p l(1db) output power at 1 db gain compression f = 940 mhz - 24 - dbm f = 1960 mhz - 25.5 - dbm f = 2140 mhz 24.0 25.5 - dbm f = 2445 mhz - 24.5 - dbm
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 4 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier [1] operation outside this range is possible but not guaranteed. [2] p l = 11 dbm per tone; spacing = 1 mhz. [3] defined at p i(rf) = ? 40 dbm; small signal conditions. 9. scattering parameters ip3 o output third-order intercept point f = 940 mhz [2] - 37.5 - dbm f = 1960 mhz [2] - 38.0 - dbm f = 2140 mhz [2] 35.0 38.0 - dbm f = 2445 mhz [2] - 37.5 - dbm nf noise figure f = 940 mhz [3] -2.9- db f = 1960 mhz [3] -3.7- db f = 2140 mhz [3] -3.7- db f = 2445 mhz [3] -4.0- db rl in input return loss f = 940 mhz - ? 9- db f = 1960 mhz - ? 10 - db f = 2140 mhz - ? 10 - db f = 2445 mhz - ? 14 - db rl out output return loss f = 940 mhz - ? 29 - db f = 1960 mhz - ? 22 - db f = 2140 mhz - ? 29 - db f = 2445 mhz - ? 11 - db table 7. dynamic characteristics ?continued input and output impedances matched to 50 . typical values at v cc =5v; t case =25 c; see section 12 ? application information ? ; unless otherwise specified. symbol parameter conditions min typ max unit table 8. scattering parameters at 5 v, mmic only f (mhz) s 11 s 21 s 12 s 22 magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) 400 0.83 ? 178.9 14.03 112.7 0.01 35.5 0.53 ? 166.3 500 0.85 178.7 11.69 104.4 0.01 38.77 0.56 ? 168.9 600 0.85 176.4 9.93 98.19 0.02 41.13 0.57 ? 172.2 700 0.86 173.8 8.67 93.04 0.02 43.1 0.58 ? 174.8 800 0.86 171.1 7.68 88.54 0.02 44.34 0.58 ? 177.4 900 0.86 168.3 6.9 84.36 0.02 44.96 0.59 179.7 1000 0.86 165.4 6.29 80.24 0.02 45.07 0.60 176.7 1100 0.87 162.7 5.72 76.42 0.02 45 0.60 173.3 1200 0.88 159.9 5.23 72.83 0.02 44.54 0.60 170.9 1300 0.88 157.3 4.80 69.34 0.03 44.17 0.61 168.4 1400 0.89 154.8 4.43 66.17 0.03 43.58 0.61 166.4 1500 0.89 153 4.09 63.33 0.03 43.02 0.62 164.7 1600 0.89 151.3 3.80 60.8 0.03 42.67 0.63 163.1 1700 0.90 149.9 3.54 58.3 0.03 42.36 0.64 162.1
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 5 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier 10. reliability information 11. moisture sensitivity 1800 0.90 148.7 3.30 56.13 0.03 41.89 0.65 161.2 1900 0.90 147.9 3.11 54.13 0.03 41.65 0.66 160.8 2000 0.91 147.5 2.93 52.63 0.03 41.7 0.66 160.5 2100 0.90 147 2.78 50.91 0.04 41.61 0.66 160.5 2200 0.90 146.9 2.65 49.5 0.04 41.59 0.67 160.9 2300 0.90 146.6 2.54 48.13 0.04 41.44 0.66 161.6 2400 0.90 146.5 2.46 46.88 0.04 41.61 0.66 161.7 2500 0.89 146.3 2.39 45.39 0.04 41.45 0.66 162.6 2600 0.88 146 2.34 43.93 0.05 41.13 0.65 162.8 2700 0.87 145.4 2.30 42.24 0.05 40.56 0.64 163.2 table 8. scattering parameters at 5 v, mmic only ?continued f (mhz) s 11 s 21 s 12 s 22 magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) magnitude (ratio) angle (degree) table 9. reliability life test conditions intrinsic failure rate htol according to jesd85; confidence level 60 %; t j =55 c; activation energy = 0.7 ev; acceleration factor according to arrhenius equation 4 table 10. moisture sensitivity level test methodology class jesd-22-a113 1
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 6 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier 12. application information 12.1 920 mhz to 960 mhz see table 11 for a list of components. pcb specification: rogers ro4003c; height = 0.508 mm; r = 3.38; copper thickness = 35 m. fig 2. 5 v application schematic; 920 mhz to 960 mhz l3 c9 c3 c4 c5 c7 c8 c6 r1 v cc l1 l2 c2 c1 msl1 msl2 msl3 msl4 msl6 msl5 rf_in v cc(rf) BGA7024 50 50 014aab021 j1 j3 j2 (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. fig 3. output power at 1 db gain compression as a function of frequency fig 4. power gain as a function of frequency f (ghz) 0.92 0.96 0.95 0.93 0.94 24 26 22 28 30 p l(1db) (dbm) 20 (1) (3) (2) 014aab022 f (ghz) 0.92 0.96 0.95 0.93 0.94 22 24 20 26 28 g p (db) 18 (1) (3) (2) 014aab023
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 7 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier t case = 25 c. (1) rl in (2) rl out (3) isl (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. fig 5. input return loss, output return loss and isolation as a function of frequency fig 6. output third-order in tercept point as a function of frequency (1) (2) (3) f (ghz) 0.92 0.96 0.95 0.93 0.94 014aab024 ? 20 ? 10 0 rl in , rl out , isl (db) ? 30 (3) (2) f (ghz) 0.92 0.96 0.95 0.93 0.94 014aab025 36 38 34 40 42 ip3 o (dbm) 32 (1) see table 11 for a list of components. fig 7. 5 v application reference board; 920 mhz to 960 mhz j3 j1 j ihgfedcba 12345678910 11 12 13 rf in j2 rf out gnd v cc gnd gnd gnd gnd msl2 msl4 msl3 msl5 msl6 msl1 r1 c8 c7 c6 c2 c3 c4 c5 c1 c9 l3 l1 l2 014aab026
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 8 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier [1] msl1 to msl6 dimensions specified as width spacing length. 12.2 1930 mhz to 1990 mhz table 11. 5 v application list of components; 920 mhz to 960 mhz see figure 2 and figure 7 for component layout. pcb: rogers ro4003c stack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks c1, c5 capacitor 68 pf dc blocking murata grm1885c1h680ja01d c2 capacitor 3.9 pf input match murata grm1885c1h3r9cz01d c3 capacitor 3.9 pf input match murata grm1885c1h3r9cz01d c4 capacitor 3.9 pf output match murata grm1885c1h3r9cz01d c6 capacitor 68 pf rf decoupling murata grm1885c1h680ja01d c7 capacitor 100 nf dc decoupling avx 0603yc104kat2a c8 capacitor 10 f dc decoupling avx 1206zg106zat2a c9 capacitor 68 nf imd suppression murata grm1888r71h683ka93d j1, j2 rf connector sma - emerson network power 142-0701-841 j3 dc connector 6-pins - molex l1 inductor 4.7 nh output match t yco electronics 36501j4n7jtdg l2 inductor 22 nh dc feed tyco electronics 36501j022jtdg l3 inductor 33 nh imd suppression tyco electronics 36501j033jtdg msl1 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match - msl2 [1] micro stripline 1.14 mm 0.8 mm 5.65 mm input match - msl3 [1] micro stripline 1.14 mm 0.8 mm 6.1 mm input match - msl4 [1] micro stripline 1.14 mm 0.8 mm 1.6 mm output match - msl5 [1] micro stripline 1.14 mm 0.8 mm 8.4 mm output match - msl6 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match - r1 resistor 0 - multicomp mc 0.063w 0603 0r pcb - ro4003c - - see table 12 for a list of components. pcb specification: rogers ro4003c; height = 0.508 mm; r = 3.38; copper thickness = 35 m. fig 8. 5 v application schematic; 1930 mhz to 1990 mhz c3 c4 c6 c7 c5 r1 v cc l1 c2 c1 msl1 msl2 msl3 msl4 msl5 msl6 msl7 50 50 rf_in j1 j3 j2 v cc(rf) BGA7024 014aab0 27
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 9 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. fig 9. output power at 1 db gain compression as a function of frequency fig 10. power gain as a function of frequency 014aab028 f (ghz) 1.93 1.99 1.97 1.95 24 26 22 28 30 p l(1db) (dbm) 20 (3) (2) (1) 014aab029 f (ghz) 1.93 1.99 1.97 1.95 14 16 12 18 20 g p (db) 10 (2) (1) (3) t case = 25 c. (1) rl in (2) rl out (3) isl (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. fig 11. input return loss, output return loss and isolation as a function of frequency fig 12. output third-order in tercept point as a function of frequency f (ghz) 1.93 1.99 1.97 1.95 014aab030 ? 20 ? 10 0 rl in , rl out , isl (db) ? 30 (1) (3) (2) 014aab031 f (ghz) 1.93 1.99 1.97 1.95 36 38 34 40 42 ip3 o (dbm) 32 (3) (2) (1)
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 10 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier see table 12 for a list of components. fig 13. 5 v application reference board; 1930 mhz to 1990 mhz j3 j1 j ihgfedcba 12345678910 11 12 13 rf in j2 rf out gnd v cc gnd gnd gnd gnd msl2 msl4 msl3 msl5 msl6 msl7 msl1 r1 c7 c6 c5 c3 c2 c4 c1 l1 014aab032
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 11 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier [1] msl1 to msl7 dimensions specified as width spacing length. 12.3 2110 mhz to 2170 mhz table 12. 5 v application list of components; 1930 mhz to 1990 mhz see figure 8 and figure 13 for component layout. pcb: rogers ro4003c stack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks c1, c4 capacitor 15 pf dc blocking murata grm1885c1h150ja01d c2 capacitor 2.4 pf input match murata grm1885c1h2r4cz01d c3 capacitor 1.5 pf output match murata grm1885c1h1r5cz01d c5 capacitor 15 pf rf decoupling murata grm1885c1h150ja01d c6 capacitor 100 nf dc decoupling avx 0603yc104kat2a c7 capacitor 10 f dc decoupling avx 1206zg106zat2a j1, j2 rf connector sma - emerson network power 142-0701-841 j3 dc connector 6-pins - molex l1 inductor 22 nh dc feed tyco electronics 36501j022jtdg msl1 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match - msl2 [1] micro stripline 1.14 mm 0.8 mm 10.6 mm input match - msl3 [1] micro stripline 1.14 mm 0.8 mm 1.0 mm input match - msl4 [1] micro stripline 1.14 mm 0.8 mm 2.7 mm output match - msl5 [1] micro stripline 1.14 mm 0.8 mm 3.2 mm output match - msl6 [1] micro stripline 1.14 mm 0.8 mm 5.5 mm output match - msl7 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match - r1 resistor 0 - multicomp mc 0.063w 0603 0r pcb - ro4003c - - see table 13 for a list of components. pcb specification: rogers ro4003c; height = 0.508 mm; r = 3.38; copper thickness = 35 m. fig 14. 5 v application schematic; 2110 mhz to 2170 mhz c3 c4 c2 c1 msl1 msl2 msl3 msl4 msl5 msl6 msl7 50 50 c6 c7 c5 r1 v cc l1 rf_in v cc(rf) BGA7024 014aab03 3 j1 j2 j3
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 12 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. fig 15. output power at 1 db gain compression as a function of frequency fig 16. power gain as a function of frequency 014aab034 f (ghz) 2.11 2.17 2.15 2.13 24 26 22 28 30 p l(1db) (dbm) 20 (3) (2) (1) 014aab035 f (ghz) 2.11 2.17 2.15 2.13 14 16 12 18 20 g p (db) 10 (2) (1) (3) t case = 25 c. (1) rl in (2) rl out (3) isl (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. fig 17. input return loss, output return loss and isolation as a function of frequency fig 18. output third-order in tercept point as a function of frequency f (ghz) 2.11 2.17 2.15 2.13 014aab036 ? 20 ? 10 0 rl in , rl out , isl (db) ? 30 (3) (1) (2) 014aab037 f (ghz) 2.11 2.17 2.15 2.13 36 38 34 40 42 ip3 o (dbm) 32 (1) (2) (3)
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 13 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier see table 13 for a list of components. fig 19. 5 v application reference board; 2110 mhz to 2170 mhz j3 j1 j ihgfedcba 12345678910 11 12 13 rf in j2 rf out gnd v cc gnd gnd gnd gnd msl2 msl4 msl3 msl5 msl6 msl7 msl1 r1 c7 c6 c5 c3 c2 c4 c1 l1 014aab038
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 14 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier [1] msl1 to msl7 dimensions specified as width spacing length. 12.4 2405 mhz to 2485 mhz table 13. 5 v application list of components; 2110 mhz to 2170 mhz see figure 14 and figure 19 for component layout. pcb: rogers ro4003c stack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks c1, c4 capacitor 15 pf dc blocking murata grm1885c1h150ja01d c2 capacitor 2.2 pf input match murata grm1885c1h2r2cz01d c3 capacitor 1.5 pf output match murata grm1885c1h1r5cz01d c5 capacitor 15 pf rf decoupling murata grm1885c1h150ja01d c6 capacitor 100 nf dc decoupling avx 0603yc104kat2a c7 capacitor 10 f dc decoupling avx 1206zg106zat2a j1, j2 rf connector sma - emerson network power 142-0701-841 j3 dc connector 6-pins - molex l1 inductor 22 nh dc feed tyco electronics 36501j022jtdg msl1 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match - msl2 [1] micro stripline 1.14 mm 0.8 mm 10.6 mm input match - msl3 [1] micro stripline 1.14 mm 0.8 mm 1.0 mm input match - msl4 [1] micro stripline 1.14 mm 0.8 mm 2.7 mm output match - msl5 [1] micro stripline 1.14 mm 0.8 mm 3.2 mm output match - msl6 [1] micro stripline 1.14 mm 0.8 mm 5.5 mm output match - msl7 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match - r1 resistor 0 - multicomp mc 0.063w 0603 0r pcb - ro4003c - - see table 14 for a list of components. pcb specification: rogers ro4003c; height = 0.508 mm; r = 3.38; copper thickness = 35 m. fig 20. 5 v application schematic; 2405 mhz to 2485 mhz c3 c4 c6 c7 c5 r1 v cc l2 c2 c1 msl1 msl3 msl5 l1 msl6 msl7 j2 j3 j1 50 50 rf_in v cc(rf) BGA7024 014aab039 msl4 msl2
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 15 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. fig 21. output power at 1 db gain compression as a function of frequency fig 22. power gain as a function of frequency (2) (1) (3) f (ghz) 2.405 2.485 2.465 2.425 2.445 014aab040 24 26 22 28 30 p l(1db) (dbm) 20 (2) (1) (3) f (ghz) 2.405 2.485 2.465 2.425 2.445 014aab041 14 16 12 18 20 g p (db) 10 t case = 25 c. (1) rl in (2) rl out (3) isl (1) t case = ? 40 c. (2) t case = 25 c. (3) t case = 85 c. fig 23. input return loss, output return loss and isolation as a function of frequency fig 24. output third-order in tercept point as a function of frequency f (ghz) 2.405 2.485 2.465 2.425 2.445 014aab042 ? 20 ? 10 0 ? 30 rl in , rl out , isl (db) (1) (2) (3) (2) (1) (3) f (ghz) 2.405 2.485 2.465 2.425 2.445 014aab043 36 38 34 40 42 ip3 o (dbm) 32
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 16 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier see table 14 for a list of components. fig 25. 5 v application reference board; 2405 mhz to 2485 mhz j3 j1 j ihgfedcba 12345678910 11 12 13 rf in j2 rf out gnd v cc gnd gnd gnd gnd msl2 msl4 msl3 msl5 msl6 msl7 msl1 r1 c7 c6 c5 c3 c2 c4 l1 c1 l2 014aab044
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 17 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier [1] msl1 to msl7 dimensions specified as width spacing length. table 14. 5 v application list of components; 2405 mhz to 2485 mhz see figure 20 and figure 25 for component layout. pcb: rogers ro4003c stack; height = 0.508 mm; copper plating thickness = 35 m. component description value function remarks c1, c4 capacitor 15 pf dc blocking murata grm1885c1h150ja01d c2 capacitor 1.5 pf input match murata grm1885c1h1r5cz01d c3 capacitor 1.8 pf output match murata grm1885c1h1r8cz01d c5 capacitor 15 pf rf decoupling murata grm1885c1h150ja01d c6 capacitor 100 nf dc decoupling avx 0603yc104kat2a c7 capacitor 10 f dc decoupling avx 1206zg106zat2a j1, j2 rf connector sma - emerson network power 142-0701-841 j3 dc connector 6-pins - molex l1 inductor 3.3 nh input match tyco electronics 36501j3n3jtdg l2 inductor 22 nh dc feed tyco electronics 36501j022jtdg msl1 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm input match - msl2 [1] micro stripline 1.14 mm 0.8 mm 9.8 mm input match - msl3 [1] micro stripline 1.14 mm 0.8 mm 1.9 mm output match - msl4 [1] micro stripline 1.14 mm 0.8 mm 2.5 mm output match - msl5 [1] micro stripline 1.14 mm 0.8 mm 1.6 mm output match - msl6 [1] micro stripline 1.14 mm 0.8 mm 7.3 mm output match - msl7 [1] micro stripline 1.14 mm 0.8 mm 10.95 mm output match - r1 resistor 0 - multicomp mc 0.063w 0603 0r pcb - ro4003c - -
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 18 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier 12.5 pcb stack (1) pre-impregnated. ro4003c dielectric constant r = 3.38. fig 26. pcb stack through via rf & analog ground rf & analog routing analog routing rf & analog ground 35 m (1 oz.) copper + 0.3 m gold plating ro4003c, 0.51 mm (20 mil) 35 m (1 oz.) copper (1) 0.2 mm (8 mil) fr4, 0.15 mm (6 mil) 35 m (1 oz.) copper 35 m (1 oz.) copper 014aab045
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 19 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier 13. package outline fig 27. package outline sot89 references outline version european projection issue date iec jedec jeita dimensions (mm are the original dimensions) sot89 to-243 sc-62 06-03-16 06-08-29 w m e 1 e e h e b b 0 2 4 mm scale b p3 b p2 b p1 c d l p a plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads sot8 9 123 unit a mm 1.6 1.4 0.48 0.35 c 0.44 0.23 d 4.6 4.4 e 2.6 2.4 h e l p 4.25 3.75 e 3.0 w 0.13 e 1 1.5 1.2 0.8 b p2 b p1 0.53 0.40 b p3 1.8 1.4
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 20 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier 14. abbreviations 15. revision history table 15. abbreviations acronym description cpe customer-premises equipment dc direct current esd electrostatic discharge htol high temperature operating life ism industrial, scientific and medical mmic monolithic microwave integrated circuit moca multimedia over coax alliance pcb printed-circuit board rfid radio frequency identification tx transmit wlan wireless local area network table 16. revision history document id release date data sheet status change notice supersedes BGA7024_1 20100528 product data sheet - -
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 21 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier 16. legal information 16.1 data sheet status [1] please consult the most recently issued document before initiating or completing a design. [2] the term ?short data sheet? is explained in section ?definitions?. [3] the product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple device s. the latest product status information is available on the internet at url http://www.nxp.com . 16.2 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. short data sheet ? a short data sheet is an extract from a full data sheet with the same product type number(s) and title. a short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. for detailed and full information see the relevant full data sheet, which is available on request vi a the local nxp semiconductors sales office. in case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. product specification ? the information and data provided in a product data sheet shall define the specification of the product as agreed between nxp semiconductors and its customer , unless nxp semiconductors and customer have explicitly agreed otherwis e in writing. in no event however, shall an agreement be valid in which the nxp semiconductors product is deemed to offer functions and qualities beyond those described in the product data sheet. 16.3 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interrupt ion, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors accepts no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconductors products, and nxp semiconductors accepts no liability for any assistance with applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. limiting values ? stress above one or more limiting values (as defined in the absolute maximum ratings system of iec 60134) will cause permanent damage to the device. limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the recommended operating conditions section (if present) or the characteristics sections of this document is not warranted. constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. terms and conditions of commercial sale ? nxp semiconductors products are sold subject to the gener al terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms , unless otherwise agreed in a valid written individual agreement. in case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. nxp semiconductors hereby expressly objects to applying the customer?s general terms and conditions with regard to the purchase of nxp semiconducto rs products by customer. no offer to sell or license ? nothing in this document may be interpreted or construed as an offer to sell products t hat is open for acceptance or the grant, conveyance or implication of any lic ense under any copyrights, patents or other industrial or intellectual property rights. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from national authorities. document status [1] [2] product status [3] definition objective [short] data sheet development this document contains data from the objecti ve specification for product development. preliminary [short] data sheet qualification this document contains data from the preliminary specification. product [short] data sheet production this docu ment contains the product specification.
BGA7024_1 all information provided in this document is subject to legal disclaimers. ? nxp b.v. 2010. all rights reserved. product data sheet rev. 01 ? 28 may 2010 22 of 23 nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier quick reference data ? the quick reference data is an extract of the product data given in the limiting values and characteristics sections of this document, and as such is not comple te, exhaustive or legally binding. non-automotive qualified products ? unless this data sheet expressly states that this specific nxp semicon ductors product is automotive qualified, the product is not suitable for automotive use. it is neither qualified nor tested in accordance with automotive testing or application requirements. nxp semiconductors accepts no liabili ty for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. in the event that customer uses t he product for design-in and use in automotive applications to automotive s pecifications and standards, customer (a) shall use the product without nxp semiconductors? warranty of the product for such automotive applicat ions, use and specifications, and (b) whenever customer uses the product for automotive applications beyond nxp semiconductors? specifications such use shall be solely at customer?s own risk, and (c) customer fully indemnifies nxp semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive app lications beyond nxp semiconductors? standard warranty and nxp semiconduct ors? product specifications. 16.4 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners. 17. contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com
nxp semiconductors BGA7024 400 mhz to 2700 mhz 0.25 w high linearity silicon amplifier ? nxp b.v. 2010. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 28 may 2010 document identifier: BGA7024_1 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 18. contents 1 product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 general description . . . . . . . . . . . . . . . . . . . . . 1 1.2 features and benefits . . . . . . . . . . . . . . . . . . . . 1 1.3 applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 5 limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 static characteristics. . . . . . . . . . . . . . . . . . . . . 3 8 dynamic characteristics . . . . . . . . . . . . . . . . . . 3 9 scattering parameters . . . . . . . . . . . . . . . . . . . . 4 10 reliability information . . . . . . . . . . . . . . . . . . . . 5 11 moisture sensitivity . . . . . . . . . . . . . . . . . . . . . . 5 12 application information. . . . . . . . . . . . . . . . . . . 6 12.1 920 mhz to 960 mhz . . . . . . . . . . . . . . . . . . . . 6 12.2 1930 mhz to 1990 mhz . . . . . . . . . . . . . . . . . . 8 12.3 2110 mhz to 2170 mhz . . . . . . . . . . . . . . . . . 11 12.4 2405 mhz to 2485 mhz . . . . . . . . . . . . . . . . . 14 12.5 pcb stack . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 13 package outline . . . . . . . . . . . . . . . . . . . . . . . . 18 14 abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 19 15 revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 16 legal information. . . . . . . . . . . . . . . . . . . . . . . 20 16.1 data sheet status . . . . . . . . . . . . . . . . . . . . . . 20 16.2 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16.3 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 16.4 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21 17 contact information. . . . . . . . . . . . . . . . . . . . . 21 18 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

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